Mijing Z21 Max BGA Stencil Platform Set for Android / Hisilicon / Qualcomm Snapdragon
Features:
- Automatic precise positioning
- The new magnetic dynamic original positioning
- Strong magnetic force automatic clamping
Installation Method:
- Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
- Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)
| Weight | 0.5 kg |
|---|
