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QianLi 012 iHilt Low Gravity Center Steel for Motherboard IC Debonding Glue Cleaning Brush


 1,000  1,200

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QianLi 012 iHilt Low Gravity Center Steel for Motherboard IC Debonding Glue Cleaning

Features:

  • 012 iHilt low gravity center steel brush, rigidity and softness, treat every chip gently, low gravity center, good gripping experience, designed for cleanliness
  • Great cleaning tool with strong toughness, anti-static, low gravity center design, remove glue, solder paste, and polish chip
  • 012 low gravity center steel brush: Remove glue and solder paste, clean and polish, and clean the dust at all kinds of gaps between chips and components
  • To work on the heating platform to clean the heated chip, easily clean glue and solder paste
  • Can work in different circumstances, temperatures of which range from -20℃ to 550℃, The bristles are not easily deformed even in high-temperature environments
  • The brush head is installed with a screw twist, which can replaceable the extension
  • Pen design, flexible operation, ergonomic design, more comfortable grip

Package includes:

  • 1 x Brush
Weight 0.1 kg

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