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Remove item Thumbnail image Product Price Quantity Subtotal
× Mijing iRepair MS1 Universal Module for iPhone 14 / 14 Plus / 14 Pro / 14Pro Max Mijing iRepair MS1 Universal Module for iPhone 14 / 14 Plus / 14 Pro / 14Pro Max  3,000
 3,000
× Stencil FOR Spreadtrum CPU SU1 Stencil FOR Spreadtrum CPU SU1  600
 600
× Qualcomm SM7550 Snapdragon 7Gen3 CPU BGA Reballing Stencil for Honor 100 VIVO S18 Qualcomm SM7550 Snapdragon 7Gen3 CPU BGA Reballing Stencil for Honor 100 VIVO S18  600
 600
× Amaoe SAM12 0.12mm BGA Reballing Stencil for Qualcomm Snapdragon 865 SM8250 / Samsung Exynos 990 CPU S20 Series Amaoe SAM12 0.12mm BGA Reballing Stencil for Qualcomm Snapdragon 865 SM8250 / Samsung Exynos 990 CPU S20 Series  600
 600

Cart totals

Subtotal  4,800
Shipping
  • Note: M&P Shipping charges must be paid in advance. If the product payment is above 40,000 PKR, the remaining amount needs to be paid in advance. For further information, please Contact Us

  • Note: Full product payment must be made in advance via TCS.

Shipping to Punjab.

Total  5,300