Amaoe 24-in-1 Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone X to 15pro max
AMAOE 24 in 1 IPX-15 Universal Reballing Stencil Station Kit for iPhone X-11 12 13 14 15 Pro/Max Mini Fixture Tools
The Amaoe middle layer BGA reballing stencil station, supports iPhone X/Xs/Xs Max/11/11Pro/11Pro Max/12 Mini/12/12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max/14/14 Plus 14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max..
Built-in strong magnetic magnets / using high temperature synthetic stone / precision lamination / continuous upgrade expansion module.
Support iPhone X/11/12/13/14/15 series cell phone motherboard tinning and subsequent continuous upgrade, and the base universal later module to avoid repeated purchases.
Precise alignment, edge groove design, take the stencil by the corner to avoid the large area of the mesh at the same time to detach the solder paste was taken away
The base has three built-in strong magnets, which can effectively prevent the stencil from being slightly moved and resulting in a poor tinning effect.
Mechanic HX-T100 0.4mm High Purity Solder Wire
OPPO/VIVO OV1 Stencil AMAOE
AMAOE SAM14 BGA Reballing Stencil Template for Samsung A105F A202F A305N A40S A505F A515F A530F A600F A750F /CPU
AMAOE BGA Reballing Stencil For IPHONE 13 Pro/Max/mini series/IP13-A15/CPU/Steel Mesh IC Chip Solder Template 0.12mm
Amaoe Universal Stencil BGA ic Reballing Stencil 0.3 0.5mm
AMAOE Samsung Note 10 SM-N976V/975U Middle Layer Reballing Stencil
AMAOE Stencil Power IC PM2 Maxin MAX:1 MTK MT:1 MT:2 Series 0.12 mm Power BGA Reballing Stencil
BGA Reballing Stencil for CAR 3 CHIPS D35003F5 G24066 L7213 0XD4905GG GY8242 DRA655ATSCICYEQ1 TPS569038 ADV7483 5432AAANQ1
Amoae IPhone 11 Pro Max BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip
Amaoe Stencil for MT1/MAX1/MT1/PM1 MTK MT Power Maxim Max Power Qualcomm 



