AMAOE BB1 BGA Reballing Stencil Template for IPhone 6S 6SP 7P 8P 11 12 X XR XS Pro Max IP6/7/8 Baseband Tin Mesh
Item specifics
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Face ID Dot Projector Flex Cable For XS MAX
AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS
AMAOE IPHONE8/8P/X STAINLESS STEEL BGA REBALLING STENCIL
BGA Reballing Stencil for CAR 3 CHIPS D35003F5 G24066 L7213 0XD4905GG GY8242 DRA655ATSCICYEQ1 TPS569038 ADV7483 5432AAANQ1
MIJING ZH01 Plug-in Dot Matrix Flex Cable No Solder Programmer For iPhone 12 / 12 pro
JC JCID Dot Matrix Projector Face ID IC Chip For IPhone 15 Series
ONEPLUS 6T LCD SCREEN DIGITIZER ASSEMBLY WITH FRAME - BLACK
Amoae IPhone 11 Pro Max BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip 



