AMAOE BB1 BGA Reballing Stencil Template for IPhone 6S 6SP 7P 8P 11 12 X XR XS Pro Max IP6/7/8 Baseband Tin Mesh
Item specifics
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Amaoe Stencil Samsung EU3 for Samsung Exynos CPU 7885 RAM / 9820 / 980
BQ24157A ORG Charging IC For MOTOROLA, HUAWEI, OPPO, VIVO
Relife 60 Megapixel Digital Microscope with 4k HD Camera For Mobile Repairing
Amaoe OV2 MSM8916/MSM8939/MSM8940 BGA Reballing Stencil For OPPO VIVO CPU EMMC POWER IC Chip
Amaoe IP12 A14 CPU Power Nand IC Chip BGA Reballing Stencil
AMAOE BGA Reballing Stencil For IPhone11PRO iphone11proMAX 




