AMAOE BB1 BGA Reballing Stencil Template for IPhone 6S 6SP 7P 8P 11 12 X XR XS Pro Max IP6/7/8 Baseband Tin Mesh
Item specifics
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Samsung S8 Plus Doted LCD / Panels without Frame.
Samsung S8 Plus Doted LCD / Panels With Frame
SOPTOP SZMN binocular Microscope 7X-45X Continuous Zoom for Mobile Phone Repair
Quick A1148 original Heating Element 110V/220V for 859D+/2008/858D/858A/705 soldering station welding tools Heating Element heater
008 Multifunctioal CPU IC Glue Remover Knife Thin Blade 3pcs
Face ID Dot Projector Flex Cable For XS
JC FACE ID IPHONE 13 and 14 CHIP For Face ID Repair
Infinix S4 X626 Original LCD Display Screen Pannel
Face ID Dot Matrix Repair Mat CPU Fingerprint Infrared Camera Slot Heat Insulation Rubber Pad
Amaoe IP12 A14 CPU Power Nand IC Chip BGA Reballing Stencil 




