AMAOE BB1 BGA Reballing Stencil Template for IPhone 6S 6SP 7P 8P 11 12 X XR XS Pro Max IP6/7/8 Baseband Tin Mesh
Item specifics
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Amaoe IP12 A14 CPU Power Nand IC Chip BGA Reballing Stencil
BGA Reballing Stencil for CAR 3 CHIPS D35003F5 G24066 L7213 0XD4905GG GY8242 DRA655ATSCICYEQ1 TPS569038 ADV7483 5432AAANQ1
Samsung S8 Plus Doted LCD / Panels With Frame
SAM11 Stencil High quality For Snapdragon 710 For Samsung Exynos
JCID V1SE V1S External Battery Repair Flex For iPhone 14 14 plus
Samsung Galaxy S7 Edge F & FD Doted Panel
Infinix Hot 9 Play X680 Original LCD Display Screen Pannel
Infinix Note 8i X683 Original LCD Display Screen Pannel
AMAOE BGA Reballing Stencil For IPHONE 13 Pro/Max/mini series/IP13-A15/CPU/Steel Mesh IC Chip Solder Template 0.12mm 



