Amaoe CPU Amaoe 16 A17 BGA Reballing Stencil CPU NAND Power Amplifier PM IC For iPhone 15 Pro Max Plus 15Pro 15ProMax 15Plus
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Amaoe Stencil For MP1 Qualcomm PM660/A/660L/670/670A/PM845/540/640/PMi632
Stencil FOR iPhone X/8/8P
Amaoe OV2 MSM8916/MSM8939/MSM8940 BGA Reballing Stencil For OPPO VIVO CPU EMMC POWER IC Chip
Amoae IPhone 11 Pro Max BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip 


