Amaoe CPU Amaoe 16 A17 BGA Reballing Stencil CPU NAND Power Amplifier PM IC For iPhone 15 Pro Max Plus 15Pro 15ProMax 15Plus
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Relife RL-067A 3in1 Multifunctional Small Ironing Table for 936 / 210 / T12 Series Welding Station Phone IC Chip
Relife RL-2520 soldering wick 2.5mm
SUGON 8650Pro 1300W Hot Air Rework Station New 2025 Edition For Mobile Repair
RELIFE RL-101B 8-in-1 knife Set For Mobile Phone Mainboard BGA PCB Chip IC Repair
OPPO/VIVO OV1 Stencil AMAOE 




