Amaoe EU5 BGA Reballing Stencil For Samsung A13 A14CPU RAM Exynos 9609 9815 2100 1080 8895 3830
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.