Amaoe HW5 BGA Reballing Stencil for Huawei P7 HI6620 Memory Font Library Power Supply CPU Steel Mesh Repair
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
OPPO/VIVO OV1 Stencil AMAOE
Amaoe IP12 A14 CPU Power Nand IC Chip BGA Reballing Stencil
Amoae IPhone 11 Pro Max BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip
AMAOE IPHONE8/8P/X STAINLESS STEEL BGA REBALLING STENCIL
Stencil FOR iPhone X/8/8P
AMAOE Stencil Power IC PM2 Maxin MAX:1 MTK MT:1 MT:2 Series 0.12 mm Power BGA Reballing Stencil 




