Amaoe HW7 BGA Reballing Stencil Kirin970 HI3670 for Huawei P20/20Pro Mate10 Pro RS Honor 10 V10 CPU RAM IC

Amaoe HW7 BGA Reballing Stencil Kirin970 HI3670 for Huawei P20/20Pro Mate10 Pro RS Honor 10 V10 CPU RAM IC

100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.