Amaoe MI10 BGA Reballing Stencil for Redmi K20 K20Pro Xiaomi 9 Series 0.12mm CPU Ram Power WIFI Audio IC Chip Tin Net Repair
Poco x3 stencil
sm8150 stencil
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
PM7150A, PM8150, PM8150A, SDR8150, SM7150, SDR660,
AMAOE SAM14 BGA Reballing Stencil Template for Samsung A105F A202F A305N A40S A505F A515F A530F A600F A750F /CPU
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Amaoe IP12 A14 CPU Power Nand IC Chip BGA Reballing Stencil
Amaoe BGA Reballing Stencil CAR1 For Automobile Chip Network/D35003F5/G24066/Steel Mesh Repair Phone Tools
Amaoe Stencil for MT1/MAX1/MT1/PM1 MTK MT Power Maxim Max Power Qualcomm 




