Amaoe MI10 BGA Reballing Stencil for Redmi K20 K20Pro Xiaomi 9 Series 0.12mm CPU Ram Power WIFI Audio IC Chip Tin Net Repair
Poco x3 stencil
sm8150 stencil
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
PM7150A, PM8150, PM8150A, SDR8150, SM7150, SDR660,
Amaoe Universal Stencil BGA ic Reballing Stencil 0.3 0.5mm
AMAOE BGA Reballing Stencil For IPHONE 13 Pro/Max/mini series/IP13-A15/CPU/Steel Mesh IC Chip Solder Template 0.12mm
Stencil FOR iPhone X/8/8P
Amaoe Stencil For MP1 Qualcomm PM660/A/660L/670/670A/PM845/540/640/PMi632
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Amaoe Stencil SAM10 For SAMSUNG S10/S10+/Note10/G9730/G975/N975
SAM11 Stencil High quality For Snapdragon 710 For Samsung Exynos 

