Amaoe MI10 BGA Reballing Stencil for Redmi K20 K20Pro Xiaomi 9 Series 0.12mm CPU Ram Power WIFI Audio IC Chip Tin Net Repair
Poco x3 stencil
sm8150 stencil
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
PM7150A, PM8150, PM8150A, SDR8150, SM7150, SDR660,
SAM11 Stencil High quality For Snapdragon 710 For Samsung Exynos
BGA Reballing Stencil for CAR 3 CHIPS D35003F5 G24066 L7213 0XD4905GG GY8242 DRA655ATSCICYEQ1 TPS569038 ADV7483 5432AAANQ1
Amaoe Stencil Samsung EU3 for Samsung Exynos CPU 7885 RAM / 9820 / 980
Amaoe Universal Stencil BGA ic Reballing Stencil 0.3 0.5mm
AMAOE BGA Reballing Stencil For IPHONE 13 Pro/Max/mini series/IP13-A15/CPU/Steel Mesh IC Chip Solder Template 0.12mm
AMAOE BGA Reballing Stencil For IPhone11PRO iphone11proMAX
Amaoe Stencil SAM10 For SAMSUNG S10/S10+/Note10/G9730/G975/N975
Stencil FOR iPhone X/8/8P 



