Amaoe MI10 BGA Reballing Stencil for Redmi K20 K20Pro Xiaomi 9 Series 0.12mm CPU Ram Power WIFI Audio IC Chip Tin Net Repair
Poco x3 stencil
sm8150 stencil
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
PM7150A, PM8150, PM8150A, SDR8150, SM7150, SDR660,
OPPO/VIVO OV1 Stencil AMAOE
AMAOE Stencil Power IC PM2 Maxin MAX:1 MTK MT:1 MT:2 Series 0.12 mm Power BGA Reballing Stencil
AMAOE IPHONE8/8P/X STAINLESS STEEL BGA REBALLING STENCIL
Stencil FOR iPhone X/8/8P
Amaoe BGA Reballing Stencil CAR1 For Automobile Chip Network/D35003F5/G24066/Steel Mesh Repair Phone Tools
Amaoe Stencil SAM10 For SAMSUNG S10/S10+/Note10/G9730/G975/N975
AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS
Amaoe IP12 A14 CPU Power Nand IC Chip BGA Reballing Stencil
Amaoe BGA Reballing Stencil for Samsung S20 G988B/BR Motherboard Soldering Tin planting platform phone repair tools 



