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Amaoe OV2 MSM8916/MSM8939/MSM8940 BGA Reballing Stencil For OPPO VIVO CPU EMMC POWER IC Chip
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ic Stencil
Amaoe MI12 BGA Reballing Stencil for Redmi K30Pro Xiaomi 10 10Pro Snapdragon 865 SM8250
“Amaoe OV2 MSM8916/MSM8939/MSM8940 BGA Reballing Stencil For OPPO VIVO CPU EMMC POWER IC Chip” has been added to your cart.
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ic Stencil
Amaoe MI12 BGA Reballing Stencil for Redmi K30Pro Xiaomi 10 10Pro Snapdragon 865 SM8250
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₨
800
₨
900
Amaoe MI12 BGA Reballing Stencil for Redmi K30Pro Xiaomi 10 10Pro Snapdragon 865 SM8250 quantity
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Description
Specification
Amaoe MI12 BGA Reballing Stencil for Redmi K30Pro Xiaomi 10 10Pro Snapdragon 865 SM8250
Compatible Brand:
XIAOMI
Compatible Brand:
XIAOMI
Model Number:
For Xiaomi 10/10Pro Redmi K30 Pro 865 SM8250
Category:
ic Stencil
Tags:
AMAOE
,
stencil
,
Xiaomi 10/10Pro Redmi K30 Pro 865 SM8250
Weight
0.2 kg
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