Amaoe MI-15 BGA Reballing Stencil Template For : SM8470, SM8250,12, 12PRO,12X CPU RAM Power ADUIO PM IC Chip
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
MECHANIC Solder Paste XG-50 Soldering BGA Paste 183 degree
RELIFE RL-007G repair spot welding slice for mobile phone repair
1610A3 Tristar USB Charging IC
RELIFE RL-1000 WATER FOR CLEANING PCB BOARD
SAM11 Stencil High quality For Snapdragon 710 For Samsung Exynos 




