Amaoe MI-15 BGA Reballing Stencil Template For : SM8470, SM8250,12, 12PRO,12X CPU RAM Power ADUIO PM IC Chip
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Mechanic SD360 Solder oil Paste Flux 10CC PCB PGA BGA SMD Repair
WTR2965 For oppo R9s/xiaomi max/vivo x9i Intermediate Frequency IF IC Chip
MECHANIC R300 Solder Wick 1.5mm Desoldering Braid Wire
SUNSHINE SS-001B 24 grid cell phone Wood storage box for repair Working table storage
AMAOE BGA Reballing Stencil For IPhone11PRO iphone11proMAX 




