Amaoe MI-15 BGA Reballing Stencil Template For : SM8470, SM8250,12, 12PRO,12X CPU RAM Power ADUIO PM IC Chip
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
AMAOE BGA Reballing Stencil For IPHONE 13 Pro/Max/mini series/IP13-A15/CPU/Steel Mesh IC Chip Solder Template 0.12mm
BGA Reballing Stencil for CAR 3 CHIPS D35003F5 G24066 L7213 0XD4905GG GY8242 DRA655ATSCICYEQ1 TPS569038 ADV7483 5432AAANQ1 



