AMAOE Mi17 Stencil MT6315GP VC7920-11 77048E MT6190W MT6359 MT6365 MT6390MV MT6891Z MT6893Z MT6877V MT6833V BGA153
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Amaoe Universal Stencil BGA ic Reballing Stencil 0.3 0.5mm
Amaoe IP12 A14 CPU Power Nand IC Chip BGA Reballing Stencil
SAM11 Stencil High quality For Snapdragon 710 For Samsung Exynos
Amaoe Stencil Samsung EU3 for Samsung Exynos CPU 7885 RAM / 9820 / 980
AMAOE Stencil Power IC PM2 Maxin MAX:1 MTK MT:1 MT:2 Series 0.12 mm Power BGA Reballing Stencil 


