AMAOE Mi17 Stencil MT6315GP VC7920-11 77048E MT6190W MT6359 MT6365 MT6390MV MT6891Z MT6893Z MT6877V MT6833V BGA153
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
AMAOE SAM 13 BGA reballing Stencil Template for samsung A10S/A605F/A705F/A920F CPU SDM450/660/SM6150/MT6762
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