“AMAOE BGA Reballing Stencil For IPHONE 13 Pro/Max/mini series/IP13-A15/CPU/Steel Mesh IC Chip Solder Template 0.12mm” has been added to your cart. View cart

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ic Stencil

Amaoe MQ3 BGA Reballing Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM

₨ 800 ~~₨ 900~~

Description
Specification

Amaoe MQ3 BGA Reballing Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM

Origin: CN(Origin)
Model Number: For SM8250 7250 SM7150 SM6150 MT6885Z
Material: Alloy Steel
Usage: Home DIY
Function: Qualcomm CPU MTK
Model Number: AMAOE MQ3

Category: ic Stencil Tags: AMAOE, ic stencil, mq3, stencil

Weight	0.2 kg

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Amaoe MQ3 BGA Reballing Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM

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AMAOE Stencil Power IC PM2 Maxin MAX:1 MTK MT:1 MT:2 Series 0.12 mm Power BGA Reballing Stencil

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Amaoe MQ3 BGA Reballing Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM

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