“AMAOE BGA Reballing Stencil For IPHONE 13 Pro/Max/mini series/IP13-A15/CPU/Steel Mesh IC Chip Solder Template 0.12mm” has been added to your cart. View cart

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Amaoe MU 3 BGA Reballing Stencil for MTK CPU

ic Stencil, Tools

Amaoe MU 3 BGA Reballing Stencil for MTK CPU

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₨ 600 ~~₨ 700~~

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Description
Specification

Amaoe MU 3 BGA Reballing Stencil for MTK CPU MT6739V MT6762V MT6771V MT6763V MT6757

Origin: CN(Origin)
Material: Stainless steel
Brand name: Amaoe
Model: MU 3
thickness: 0.12mm

Categories: ic Stencil, Tools Tags: AMAOE, amaoe mu 3, BGA, mtk stencil, mu3 stencil, stencil

Weight	0.2 kg

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