Amaoe MU4 BGA Stencil for samsung a32 MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer Chip Reballing Solder Tin Plant Net Steel
- Features
- 1. Brand New.
- Amaoe MU4 BGA Stencil MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer Chip Reballing Solder Tin Plant Net Steel Me
Advantage:1. Deformation resistant material2. Precise pins location
Samsung A32 stencil
3. Square round hole
4. Good material
- Origin: CN(Origin)
- Condition: New
- Type: Logic ICs
- Model Number: MU4
- Application: Mobile Phone
- Operating Temperature: 0-300
- Supply Voltage: 1.5-5V
- Dissipation Power: 0.5W
- is_customized: Yes
Mechanic HX-T100 0.4mm High Purity Solder Wire
Relife 04 Blade set for iphone back glue remover and demolition special blade (10pcs)
WLXY Precision Knife With 6 Blades
2UUL Hand Finish Blades For Phone Screen Debonding / Removal IC, Model:X
KOOCU KC1004 CLEANING WIPES CLOTHES FOR MOBILE LCD SCREEN AND CAMERA LENS
JCID V1S / V1SE / V1S Pro Dot Matrix Read and Write Activation Board Support iPhone X to 15Pro Max
Amaoe OV2 MSM8916/MSM8939/MSM8940 BGA Reballing Stencil For OPPO VIVO CPU EMMC POWER IC Chip 




