Amaoe MU4 BGA Stencil for samsung a32 MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer Chip Reballing Solder Tin Plant Net Steel
- Features
- 1. Brand New.
- Amaoe MU4 BGA Stencil MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer Chip Reballing Solder Tin Plant Net Steel Me
Advantage:1. Deformation resistant material2. Precise pins location
Samsung A32 stencil
3. Square round hole
4. Good material
- Origin: CN(Origin)
- Condition: New
- Type: Logic ICs
- Model Number: MU4
- Application: Mobile Phone
- Operating Temperature: 0-300
- Supply Voltage: 1.5-5V
- Dissipation Power: 0.5W
- is_customized: Yes
STENCIL FOR SAMSUNG S9/S9PLUS
Amaoe OV2 MSM8916/MSM8939/MSM8940 BGA Reballing Stencil For OPPO VIVO CPU EMMC POWER IC Chip
Amaoe QU1 BGA Reballing Stencil For Qualcomm CPU MSM8996 MSM8976 MSM899
Amaoe MQ3 BGA Reballing Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM
Amaoe QU2 High quality For MSM8953 MSM8937 MSM8998 MSM8916 BGA reball Stencil
AMAOE SAM 13 BGA reballing Stencil Template for samsung A10S/A605F/A705F/A920F CPU SDM450/660/SM6150/MT6762 

