Amaoe MU4 BGA Stencil for samsung a32 MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer Chip Reballing Solder Tin Plant Net Steel
- Features
- 1. Brand New.
- Amaoe MU4 BGA Stencil MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer Chip Reballing Solder Tin Plant Net Steel Me
Advantage:1. Deformation resistant material2. Precise pins location
Samsung A32 stencil
3. Square round hole
4. Good material
- Origin: CN(Origin)
- Condition: New
- Type: Logic ICs
- Model Number: MU4
- Application: Mobile Phone
- Operating Temperature: 0-300
- Supply Voltage: 1.5-5V
- Dissipation Power: 0.5W
- is_customized: Yes
AMAOE SAM14 BGA Reballing Stencil Template for Samsung A105F A202F A305N A40S A505F A515F A530F A600F A750F /CPU
Amoae IPhone 11 Pro Max BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip
Amaoe Qualcom QU4 CPU Stencil
Amaoe QU1 BGA Reballing Stencil For Qualcomm CPU MSM8996 MSM8976 MSM899
Amaoe QU2 High quality For MSM8953 MSM8937 MSM8998 MSM8916 BGA reball Stencil 

