Amaoe MU4 BGA Stencil for samsung a32 MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer Chip Reballing Solder Tin Plant Net Steel
- Features
- 1. Brand New.
- Amaoe MU4 BGA Stencil MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer Chip Reballing Solder Tin Plant Net Steel Me
Advantage:1. Deformation resistant material2. Precise pins location
Samsung A32 stencil
3. Square round hole
4. Good material
- Origin: CN(Origin)
- Condition: New
- Type: Logic ICs
- Model Number: MU4
- Application: Mobile Phone
- Operating Temperature: 0-300
- Supply Voltage: 1.5-5V
- Dissipation Power: 0.5W
- is_customized: Yes
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro Pro BGA297 Snapdragon 778G SM7325 CPU Power NAND IC
Amaoe HW5 BGA Reballing Stencil for Huawei P7 HI6620 Memory
Amaoe SAM21 Qualcomm SM8750 Snapdragon 8 Elite CPU BGA Reballing Stencil for Samsung S25 / S25 Plus 




