Amaoe QU1 BGA Reballing Stencil For Qualcomm CPU MSM8996 MSM8976 MSM899
Amaoe QU1 BGA Reballing Stencil For Qualcomm CPU MSM8996 MSM8976 MSM8992 Repair Tools Tin Planting Template Solder Steel Mesh Heating Direct Net
–Material : High quality steel.
–Strong Magnetic Attraction.
–thickness: 0.12mm.
–Precision Positioning.
- Origin: CN(Origin)
- Model Number: For MSM8996 MSM8976 MSM899
- Material: Alloy Steel
- Usage: Home DIY
- Function: Qualcomm CPU
- Model Number: AMAOE QU1
Original QUICK 900M-T-IS Soldering Iron Tips
Mechanic HX-T100 0.4mm High Purity Solder Wire
Amaoe SAM12 0.12mm BGA Reballing Stencil for Qualcomm Snapdragon 865 SM8250 / Samsung Exynos 990 CPU S20 Series 




