AMAOE SAM14 BGA Reballing Stencil Template for Samsung A105F A202F A305N A40S A505F A515F A530F A600F A750F /CPU
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: Silver
Material: stainless steel
MiJing C20 pro 4 in 1 Main Motherboard Layered Test For IPhone 12/12mini/12Pro/12pro Max
MiJing ZH01 Multi-function Programmer with Dot Projector Board & Battery Board with Flexes For Iphone
AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS
OPPO/VIVO OV1 Stencil AMAOE
Amaoe Stencil SAM10 For SAMSUNG S10/S10+/Note10/G9730/G975/N975 



