AMAOE SAM14 BGA Reballing Stencil Template for Samsung A105F A202F A305N A40S A505F A515F A530F A600F A750F /CPU
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: Silver
Material: stainless steel
Power IC 6350V Mediatek Oppo, Vivo, Huawei, Nokia
U3101 338S00105 Big Ring Audio IC Chip for iPhone 6s 6s-Plus 7 7plus
SM5703 IC for A8 A8000 J500F charging USB charging charger IC
610A3B For iPhone 7 7Plus U2 Charger IC Original new
1612A1 USB Charging IC For IPhone X
1610A3 Tristar USB Charging IC
AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS
MT6357CRV Power IC Power Supply IC MT6357CRV
Amaoe BGA Reballing Stencil CAR1 For Automobile Chip Network/D35003F5/G24066/Steel Mesh Repair Phone Tools 




