AMAOE Middle Layer Reballing Stencil Template for Samsung Note 10 SM-N976V/975U/ Solder Tin Planting Net
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Amaoe Stencil Samsung EU3 for Samsung Exynos CPU 7885 RAM / 9820 / 980
Stencil FOR iPhone X/8/8P
Amaoe OV2 MSM8916/MSM8939/MSM8940 BGA Reballing Stencil For OPPO VIVO CPU EMMC POWER IC Chip 



