AMAOE Stencil MP1 MTK Qualcomm BGA Reballing Stencil For PM660 /A/660L /670/ 670A/ PM845/540/ 640/PMi632 Qualcomm Power Supply Ic

Item specification:

Type:Other
Origin:CN(Origin)
TYPE:bga stencil template
MODEL:MP:1
Applicable Model:FOR MTK Qualcomm POWER supply ic

100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.