Amaoe Stencil For MTK MT1 Power Maxim Max Power Qualcomm PM Power IC BGA Reballing Stencil MP1/MAX1/MT1/PM1
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Shipment not included, Shipment cost will be calculated and tell you after order.