Amaoe stencil SAM10 For SAMSUNG S10/S10+/Note10/G9730/G975/N975 SM8150/Exynos 9820/855 CPU RAM WIFI Chip BGA Stencil IC Solder Reballing
Type: Hand Tool Parts
is_customized: No
Model Number: Amaoe SAM10
Material: STAINLESS STEEL
Usage: Commercial Manufacture
thickness: 0.12mm
sm8150 stencil poco x3 stencil
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: Silver
Material: stainless steel
Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.
Amaoe IP12 A14 CPU Power Nand IC Chip BGA Reballing Stencil
Amoae IPhone 11 Pro Max BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip
OPPO/VIVO OV1 Stencil AMAOE
AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS
AMAOE BGA Reballing Stencil For IPhone11PRO iphone11proMAX
Amaoe BGA Reballing Stencil CAR1 For Automobile Chip Network/D35003F5/G24066/Steel Mesh Repair Phone Tools
Stencil FOR iPhone X/8/8P
Amaoe Stencil for MT1/MAX1/MT1/PM1 MTK MT Power Maxim Max Power Qualcomm
AMAOE IPHONE8/8P/X STAINLESS STEEL BGA REBALLING STENCIL
AMAOE Stencil Power IC PM2 Maxin MAX:1 MTK MT:1 MT:2 Series 0.12 mm Power BGA Reballing Stencil
AMAOE BGA Reballing Stencil For IPHONE 13 Pro/Max/mini series/IP13-A15/CPU/Steel Mesh IC Chip Solder Template 0.12mm
PM8150B Power IC Power Supply Management Chip PM
1612A1 USB Charging IC For IPhone X
Amaoe OV2 MSM8916/MSM8939/MSM8940 BGA Reballing Stencil For OPPO VIVO CPU EMMC POWER IC Chip
U3101 338S00105 Big Ring Audio IC Chip for iPhone 6s 6s-Plus 7 7plus 