Amaoe stencil SAM10 For SAMSUNG S10/S10+/Note10/G9730/G975/N975 SM8150/Exynos 9820/855 CPU RAM WIFI Chip BGA Stencil IC Solder Reballing
Type: Hand Tool Parts
is_customized: No
Model Number: Amaoe SAM10
Material: STAINLESS STEEL
Usage: Commercial Manufacture
thickness: 0.12mm
sm8150 stencil poco x3 stencil
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: Silver
Material: stainless steel
Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.
AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS
Amoae IPhone 11 Pro Max BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip
AMAOE SAM14 BGA Reballing Stencil Template for Samsung A105F A202F A305N A40S A505F A515F A530F A600F A750F /CPU
Eakins Microscope 22 Mega Pixel 2K QUAD HD Camera 60F/S HDMI VGA Microscope Camera+130X C mount lens+56 LED Ring Light
Relife RL-067A 3in1 Multifunctional Small Ironing Table for 936 / 210 / T12 Series Welding Station Phone IC Chip
AMAOE BGA Reballing Stencil For IPhone11PRO iphone11proMAX 



