Amaoe stencil SAM10 For SAMSUNG S10/S10+/Note10/G9730/G975/N975 SM8150/Exynos 9820/855 CPU RAM WIFI Chip BGA Stencil IC Solder Reballing
Type: Hand Tool Parts
is_customized: No
Model Number: Amaoe SAM10
Material: STAINLESS STEEL
Usage: Commercial Manufacture
thickness: 0.12mm
sm8150 stencil poco x3 stencil
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: Silver
Material: stainless steel
Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.
 
			 
				 SAM11 Stencil High quality For Snapdragon 710 For Samsung Exynos
SAM11 Stencil High quality For Snapdragon 710 For Samsung Exynos						 AMAOE BGA Reballing Stencil For IPhone11PRO iphone11proMAX
AMAOE BGA Reballing Stencil For IPhone11PRO iphone11proMAX						 MT6357CRV Power IC Power Supply IC MT6357CRV
MT6357CRV Power IC Power Supply IC MT6357CRV						 Original DCSD Alex Cable Engineering Serial Port Cable for iPhone 6 to 14 pro max iPad MagicoCFG
Original DCSD Alex Cable Engineering Serial Port Cable for iPhone 6 to 14 pro max iPad MagicoCFG						 Amoae IPhone 11 Pro Max BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip
Amoae IPhone 11 Pro Max BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip						 BGA Reballing Stencil for CAR 3 CHIPS D35003F5 G24066 L7213 0XD4905GG GY8242 DRA655ATSCICYEQ1 TPS569038 ADV7483 5432AAANQ1
BGA Reballing Stencil for CAR 3 CHIPS D35003F5 G24066 L7213 0XD4905GG GY8242 DRA655ATSCICYEQ1 TPS569038 ADV7483 5432AAANQ1						 Amaoe IP12 A14 CPU Power Nand IC Chip BGA Reballing Stencil
Amaoe IP12 A14 CPU Power Nand IC Chip BGA Reballing Stencil						



