Amaoe U-APU8 CPU Comprehensive BGA Reballing Stencil for Apple A11 to A17 – Carve Through Edition
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS 



