Amaoe U-MTK1 UBGA BGA Reballing Stencil MT6528V 6592V 6732V 6752V 6735V 6753V 6750V 6755V for mobile repairing

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component’s pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series

• * MT6528V
• * 6592V
• * 6732V
• * 6752V
• * 6735V
• * 6753V
• * 6750V
• * 6755V