Amaoe U-MTK2 Stencil MT6595W 6795W 6797W RAM 256 MT6169V MT6331P BGA 153 MT6351V For Mobile Repairing

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component’s pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series

• * MT6595W
• * 6795W
• * 6797W
• * RAM 256
• * MT6169V
• * MT6331P
• * BGA 153
• * MT6351V