Amaoe U-MTK3 UBGA BGA Reballing Stencil MT6580A MT6350V MT6356W MT6357V BGA254 MT6351DV MT6355

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component’s pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series

• * MT6580A
• * MT6350V
• * MT6356W
• * MT6357V
• * BGA254
• * MT6351DV
• * MT6355W
• * MT6176V
• * 6739V
• * 6757V
• * 6763V