₨ 600 ₨ 700
Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.
Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component’s pads with precision.
Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series
Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.
Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component’s pads with precision.
Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series
| Weight | 0.1 kg |
|---|
Select at least 2 products
to compare
Glass Liquid Alcohol 150ml Bottle Phone Repair Remover Cleaner Bottle mobile repair tools 
MECHANIC iMini Precision Magnetic 0.8 Screwdriver Tool for Mobile Phone Repair 
Amaoe IP12 A14 CPU Power Nand IC Chip BGA Reballing Stencil 
