Amaoe U-MTK6 MTK CPU Series BGA Reballing Stencil for MT6889Z / 6891Z / 6893Z / 6855V
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Amaoe Universal Stencil BGA ic Reballing Stencil 0.3 0.5mm
AMAOE BGA Reballing Stencil For IPhone11PRO iphone11proMAX
Stencil FOR iPhone X/8/8P
OPPO/VIVO OV1 Stencil AMAOE
Amaoe OV2 MSM8916/MSM8939/MSM8940 BGA Reballing Stencil For OPPO VIVO CPU EMMC POWER IC Chip 



