Amaoe UN:2 CPU BGA Reballing Stencil for UMW2652 UMP510G UIP8910 UIS8910 UMS9230H SGM41512 BGA153 BGA200

100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.