- Rework help paste applied to mobile phone PCB, BGA and SMD’s PGA etc.
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- It’s used in low ionic activator system, tin-run speed.
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- Low level of smoke,surface insulation resistance value is high residue after curing.
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- Therefore, the electrical properties of the cell phones and other communications products, very little interference.
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Features:
- Amtech NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR.
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- Amtech Paste recommended for BGA, CSP and other solder ball array repair and fill the ball.
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- When using smoke less, no residue. Affordable.
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Suitable for:
- Cards, cell phone chip, video chip BGA solder, bumping.
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- Also can use off the tin, the effect is very ideal.
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- The residue was less bright spot, less smoke, no pungent odor, do not run the ball.
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