FX08 Hand Polished Integrated Blade PCB IC Removal Tool

Hand Polished Integrated Blade adopts to integrated handle design and 300℃ high temperature handle ,easy to use and durable. Hand-polished, pry out IC hard disk CPU delamination. 5 forms, 5 options, fully covering various repair scenarios. Suitable for prying mobile phone/iPhone hard disk, removing glue, scraping glue, prying CPU edge glue and other operations.

Features:
1. 300℃ high temperature resistant handle support, easy to use and durable. In the process of mobile phone repair, the blade is usually used in conjunction with a hot air gun, which can withstand high temperatures up to 300℃.
2. Hand-polished, easy to pry out IC hard disk CPU delamination. Carefully hand-polished, no burrs or teeth, easy to pick up precision components, not easy to damage.
3. 5 forms, 5 options, comprehensive coverage of various repair scenarios.Model: 01 Pry iC CPU to remove glue, Model: 02 Scrape the adhesive on the edge of iC, Model: 03 Alien rubber cutting knife, Model:04 Pry CPU and layer it, Model: 05 Pry out the iC hard drive.
4. Integrated handle design, no handle required, can be used immediately after receiving.