MW:2 BGA reballing stencil for huawei G7/G8/7I/5S MSM8916/8939/MT6753V CPU phone repair tools
Item specifics
Type:Hand Tool Parts
Origin:CN(Origin)
Material:STAINLESS STEEL
model:HW 2
Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.
Iphone 6 6p ic chip BGA Stencil
BQ24158 ORG Charging IC for Oppo R9 Plus
BQ24192 ORG Charging IC For HUAWEI P6 P7 FOR LENOVO K900
SUNSHINE SS-022B ANTI-STATIC MOTHERBOARD CLEANING BRUSH FOR MOBILE PHONE REPAIR
Amaoe Universal Stencil BGA ic Reballing Stencil 0.3 0.5mm 



