MW:2 BGA reballing stencil for huawei G7/G8/7I/5S MSM8916/8939/MT6753V CPU phone repair tools
Item specifics
Type:Hand Tool Parts
Origin:CN(Origin)
Material:STAINLESS STEEL
model:HW 2
Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.
MECHANIC R300 Solder Wick 1.5mm Desoldering Braid Wire
Stencil FOR Qualcomm/MTK CPU MQ1 



