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MAANT SL-2 (UPGRADE) Constant Heating Platform For Glue Removal IC CPU HEATING
This model will be newly upgraded in 2024.
Compared with the previous generation, it is more intelligent, more refined in appearance and more affordable.
One-button heating, rapid heating, the temperature can be adjusted 160-250C, support multi-generation Apple, Huawei chip glue removal, tin removal work.
This applies to 99% of the chips on the market, 20mm x 18.5mm working area, supports multiple generations of Apple mobile phone chips, Huawei mobile phone chip universal hard disk, and CPU glue detinning.
There is no tin line; a wipe can easily remove tin and glue, and easy and quick Tin planting.
Air gun heating is safer than 100 degrees lower than air gun temperature scraping.
